MVS-
Integrated design and easily to be moved; Advanced ICP algorithm; No need for on-site calibration.
HD picture
23 million pixels, even pore be clearly visible.
High-precision 3D model
3 million cross linked point-cloud help more realistic simulation.
US TI chip
Strict quality control; High quality electronic components and materials.
Precise optical components
Core optical components are from international mainstream optical manufacturers.
Strong algorithms and computing power
Loaded with high-performance GPU and advanced artificial intelligence algorithms.
Technical Parameters：
- Scanning Method: HF Coded Light
- Working Distance: 700~900mm
- Video Frame Rate:85fps
- Scanning Range:400×300(mm)
- Light Source:White LED
- 3D Output Format:OBJ、 STL、CIE
- Brightness:200~220lm
- Weight:<50kg
- Rated Power:152W
- Color:24bpp
- Texture Clarity:10.0mp
- Scanning Time:<2s
- Model Generating Time:<15s
- 3D Accuracy:0.1mm
- Area Accuracy:0.01mm²
- Volume Accuracy:0.1ml
- Packing Size:1240×1560×520(mm)
- Input:100~240V 50/60Hz
0755-86702876 (8:30-18:00)
info@caszm.com
R&D Center：Building F, Advanced Institute of Chinese Academy of Sciences, Shenzhen
OHQ：13/F, Building A, CIMC Smart Park, Guang Ming, Shenzhen
Shenzhen Zhongke Zhimei Technology Co., Ltd.