MVS-
Exquisite design and light weight make it the priority for multi-environment working.
High-precision 3D model
2 million cross linked point-cloud help more realistic simulation.
Exquisite design and light weight make it the priority for multi-environment working
US TI chip
Strict quality control; High quality electronic components and materials.
Precise optical components
Core optical components are from international mainstream optical manufacturer.
Strong algorithms and computing power
Loaded with high-performance GPU and advanced artificial intelligence algorithms.
Technical Parameters：
- Scanning Method: HF Coded Light
- Working Distance: 500~700mm
- Video Frame Rate:60fps
- Scanning Range:400×300(mm)
- Light Source:White LED
- 3D Output Format:OBJ、 STL、CIE
- Brightness:200~220lm
- Weight:<4.56 kg
- Rated Power:60W
- Color:24bpp
- Texture Clarity:6.0mp
- Scanning Time:<3s
- Model Generating Time:<15s
- 3D Accuracy:0.2mm
- Area Accuracy:0.04mm²
- Volume Accuracy:NA
- Packing Size:435×320×135(mm)
- Input:DC 12V/5A
0755-86702876 (8:30-18:00)
info@caszm.com
R&D Center：Building F, Advanced Institute of Chinese Academy of Sciences, Shenzhen
OHQ：13/F, Building A, CIMC Smart Park, Guang Ming, Shenzhen
Shenzhen Zhongke Zhimei Technology Co., Ltd.